Packaging

Environmental Footprints of Packaging (Repost)  eBooks & eLearning

Posted by insetes at Oct. 14, 2017
Environmental Footprints of Packaging (Repost)

Environmental Footprints of Packaging By Subramanian Senthilkannan Muthu
2015 | 202 Pages | ISBN: 9812879110 | PDF | 4 MB

Formulating, Packaging, and Marketing of Natural Cosmetic Products (repost)  eBooks & eLearning

Posted by libr at Sept. 28, 2017
Formulating, Packaging, and Marketing of Natural Cosmetic Products (repost)

Formulating, Packaging, and Marketing of Natural Cosmetic Products by Nava Dayan, Lambros Kromidas and Gaurav Kale
English | ISBN: 047048408X | 2011 | 444 pages | PDF | 23,5 MB
Best Practices for Graphic Designers, Packaging: An essential guide for implementing effective package design solutions (repost

Best Practices for Graphic Designers, Packaging: An essential guide for implementing effective package design solutions by Grip
English | 2013 | ISBN: 1592538134 | ISBN-13: 9781592538133 | 192 pages | PDF | 45 MB

CreativeMarket - BUNDLE Party Packaging Mock ups  Graphics

Posted by angus77 at Aug. 29, 2017
CreativeMarket - BUNDLE Party Packaging Mock ups

CreativeMarket - BUNDLE Party Packaging Mock ups
Photoshop PSD | 5400x3600 | 2.25 GB

Food Packaging Materials: Testing & Quality Assurance  eBooks & eLearning

Posted by ksveta6 at Aug. 17, 2017
Food Packaging Materials: Testing & Quality Assurance

Food Packaging Materials: Testing & Quality Assurance by Preeti Singh, Ali Abas Wani, Horst-Christian Langowski
2017 | ISBN: 1466559942 | English | 356 pages | PDF | 13 MB

RF and Microwave Microelectronics Packaging II: 2 [Repost]  eBooks & eLearning

Posted by hill0 at Aug. 9, 2017
RF and Microwave Microelectronics Packaging II: 2 [Repost]

RF and Microwave Microelectronics Packaging II: 2 by Ken Kuang
English | 22 Mar. 2017 | ISBN: 3319516965 | 186 Pages | PDF | 6.24 MB

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
Encyclopedia Of Thermal Packaging, Set 1: Thermal Packaging Techniques (A 6-Volume Set) (Repost)

Avram Bar-Cohen, "Encyclopedia Of Thermal Packaging, Set 1: Thermal Packaging Techniques (A 6-Volume Set)"
2013 | ISBN-10: 9814313785 | 1580 pages | PDF | 31 MB
3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) [Repost]

3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li
English | 8 Feb. 2017 | ISBN: 3319445847 | 476 Pages | PDF | 20.87 MB

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging,

The Automatic Packaging Machinery Sector in Italy and Germany (Repost)  eBooks & eLearning

Posted by step778 at July 14, 2017
The Automatic Packaging Machinery Sector in Italy and Germany (Repost)

Marco Fortis, Monica Carminati, "The Automatic Packaging Machinery Sector in Italy and Germany"
2014 | pages: 57 | ISBN: 3319127624 | PDF | 5,4 mb

Practical Guide to the Packaging of Electronics, 2nd Edition - Ali Jamnia (Repost)  eBooks & eLearning

Posted by Maroutan at July 2, 2017
Practical Guide to the Packaging of Electronics, 2nd Edition - Ali Jamnia (Repost)

Practical Guide to the Packaging of Electronics, 2nd Edition: Thermal and Mechanical Design and Analysis - Ali Jamnia
English | 2009 | 320 Pages | ISBN: 1420065319 | PDF | 5.49 MB

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification…